Packaging Quality and Reliability Engineer

Intel•Chandler, AZ

2d•Onsite

About The Position

As a Packaging Quality and Reliability Engineer, you will help ensure the quality and reliability of packaging components used in Intel's manufacturing processes. You will evaluate materials, processes, and techniques against product requirements and assess compliance with quality parameters. The role contributes to Intel's delivery of reliable, high-quality solutions to customers. The position is part of Intel Foundry, which focuses on semiconductor innovation, manufacturing excellence, and continuous improvement in packaging quality and reliability standards. The engineer will collaborate with packaging technology development teams and support quality systems, customer responses, and benchmarking of Intel Foundry packaging offerings against industry standards. This role requires an on-site presence in Phoenix, Arizona. It is an experienced-hire position on Shift 1.

Requirements

Bachelor's degree in Engineering or a related field and 6 or more years of applicable experience, or a Master's degree in Engineering or a related field and 4 or more years of applicable experience, or a PhD in Engineering or a related field and 2 or more years of applicable experience.
Proficiency in statistical process control and reliability modeling techniques.
Expertise in quality audits, testing mechanisms, and packaging reliability standards.
Hands-on experience in manufacturing environments and analytical tools for process improvement.

Nice To Haves

Familiarity with assembly and wafer-level assembly process technology.
Knowledge of industry standards for package quality and reliability.
Experience in excursion management and customer response processes.
Strong problem-solving, communication, and customer service skills.

Responsibilities

Develop and maintain quality and reliability standards for packaging components and processes.
Specify inspection mechanisms and conduct audits to ensure compliance with specifications.
Perform statistical analysis and stress testing to identify reliability failure modes and improve processes.
Define metrology strategies and oversee the collection of comprehensive quality data.
Collaborate with packaging technology development teams to deliver process maturity and new acceleration techniques.
Drive continuous improvement in manufacturing quality systems, specifications, and training programs.
Support incident management, customer inquiries, and excursion responses to ensure customer satisfaction.
Benchmark Intel Foundry packaging offerings against industry standards.