As a Quality and Reliability Engineer (QRE) in Intel Foundry’s Foundry Quality, Reliability, and Labs (FQRL) organization, you will work with fab module engineers, process integration teams, and internal and external employees around the world. This is an on-site role based in Oregon and requires evening meetings most workdays. The Wafer Packaging Manufacturing (WPM) organization supports semiconductor wafer processing, testing, and die-to-wafer assembly, including Intel’s advanced packaging strategy. C4 (bumping) QREs cover critical process segments such as interposer, micro-logical, and package-side bumping. You will manage quality issues, assess risk related to suspect or non-conforming material, support downstream partners with excursions and investigations, and drive improvements in quality and reliability. The role also supports certification and ramp of new technologies and includes 24x7 on-call response as part of an engineering rotation. The position calls for strong technical judgment, cross-functional collaboration, communication, planning, and the ability to work under pressure in a changing environment.
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Job Type
Full-time
Career Level
Entry Level