Packaging Module Equipment Development Engineer

Intel Corporation•Chandler, AZ

22h•$133,800 - $188,890•Onsite

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. They will collaborate with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. The role involves innovating next generation equipment, materials and fabrication processes to enhance semiconductor packaging capabilities at scale, managing projects to meet product development timelines, applying formal education and judgment to solve technical problems, providing sustaining support for equipment performance and process health in high-volume manufacturing, and responding promptly to foundry customer requests and events.

Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 6+ months of relevant experience
Minimum GPA of 3.5
At least one publication in a peer-reviewed technical journal.
Must have the required degree prior to your start date.
Relevant experience and deep understanding in solid mechanics applying thermal mechanical coupling behaviors into degradation. (Thermal Cycling impact)

Nice To Haves

Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Delivering results for complex, time-critical technical projects.
Semiconductor fabrication processes and technology.
Previous related work experience in a semiconductor foundry.

Responsibilities

Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation equipment, materials and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.