WATD Module Development Engineer

Intel Corporation•Hillsboro, OR

2d•$155,520 - $219,550•Onsite

About The Position

Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.

Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
OR Master's degree in the same fields with 4+ years of experience.
OR PhD in the same fields with 2+ years of experience.
Experience listed above should be a combination of the following: Development methodologies, statistical process control, and/or data analytics.
Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

Nice To Haves

Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
Demonstrated expertise in leading programs from early strategy formation through high-volume production.
Recognized technical leadership with a proven track record of solving complex engineering challenges.
Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.

Responsibilities

Drive technology development and enablement for both high-volume manufacturing and future technologies.
Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
Collaborate with equipment and material suppliers to design and implement enabling process technologies.
Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
Optimize production efficiency, manufacturing techniques, and output for existing and new products.
Partner with cross-functional teams to ensure process integration and alignment with project deliverables.