Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

4d•$133,800 - $188,890•Onsite

About The Position

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology. Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry.

Requirements

Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
+4 years of experience in: Process development, equipment adjustment, and manufacturing process control.
Design of experiments (DOE) principles and statistical data analysis.
Process characterization and statistical process control methodologies.
Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.

Nice To Haves

Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
Analytical skills and experience troubleshooting integrated technology challenges.
Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
Experience working with both organic and inorganic materials in packaging processes.
1 year of Photolithography experience.

Responsibilities

Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
Document advancements through white papers, technical reports, and data analysis.
Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.