Advanced Packaging Dry Etch Module Development Engineer

Intel Corporation•Hillsboro, OR

4d•$133,800 - $255,200•Onsite

About The Position

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.

Requirements

Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
Experience with plasma etch equipment platforms

Nice To Haves

Experience in wafer-level assembly, advanced packaging, or related technologies.
Demonstrated success in leading programs from initial strategy development through high-volume production.
Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.

Responsibilities

Develop and optimize plasma etch processes for advanced packaging applications
Design experiments (DOE) to characterize process windows and optimize etch performance
Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
Partner with equipment suppliers to design, test, and implement innovative process solutions.
Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.