Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•$99,030 - $188,890•Onsite

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing thermal interface technology and material solutions, collaborating with multifunctional and cross-organizational teams to optimize assembly processes, innovating next generation materials, equipment, and fabrication processes, managing projects to meet product development timelines, applying formal education and judgment to solve technical problems, providing sustaining support for equipment performance and process health in high-volume manufacturing, and responding promptly to foundry customer requests and events. The ideal candidate will demonstrate technical leadership, strategic planning, and critical thinking, the ability to coach and develop technical teams, tolerance for ambiguity and adaptability in a dynamic environment, flexibility in managing changing priorities and responsibilities, experience leading teams in a highly matrixed organization, initiative and ability to work independently, and strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence.

Requirements

Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field
Minimum GPA of 3.5.
At least one publication in a peer-reviewed technical journal.

Nice To Haves

Delivering results for complex, time-critical technical projects.
Semiconductor fabrication processes and technology.
Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Previous related work experience in a semiconductor foundry.

Responsibilities

Developing thermal interface technology and material solutions to support Intel's future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.