Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

3d•$115,110 - $188,890•Onsite

About The Position

As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's cutting-edge assembly packaging platform technologies. Through your expertise in developing innovative solutions, optimizing processes, and collaborating with cross-functional teams, you will contribute to Intel's mission to deliver industry-leading semiconductor packaging technologies. You will be instrumental in ensuring the quality, reliability, and scalability of Intel's packaging solutions, ultimately driving to meet customer needs for emerging mobile, edge, and hyperscale computing platforms. Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Requirements

Bachelor's degree with 6+ years of experience in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.
OR Master's degree with 4+ years of experience in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.
OR, or PhD in the field of Metallurgy or Materials Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering.
Experience listed above should be a combination of the following: Design of experiments, statistical methods, and process characterization.
Packaging materials, assembly processes, and equipment development relevant to semiconductor technologies.
Die packaging, quality/reliability for packaging, and disciplined execution of manufacturing solutions.
Data analysis and statistical principles.
Design of Experiments, materials characterization principles and tools.

Nice To Haves

Knowledge of Intel and general semiconductor packaging and assembly technologies.
Experience communicating with suppliers and driving supplier technology development.
Experience leading and coaching technical teams in a matrixed environment.
Technical innovation and delivery of results for complex, time-critical technical projects.
Hands-on experience in semiconductor fabrication processes and technology.
Prior experience with dispense, mold, or cure equipment technologies in packaging development.

Responsibilities

Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
Develops materials, process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develop materials technologies to integrate with module equipment and processes that can withstand and survive under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Ensures manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures, and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new materials characterization techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental materials structure-property-performance understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.
Provides materials expertise concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.