Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•Onsite

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1/IHS), and SMT/PCB technologies to support Intel’s future packaging platforms. This role involves collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. The engineer will also innovate next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale, manage projects to meet product development timelines, apply formal education and judgment to solve technical problems, provide sustaining support for equipment performance and process health in high-volume manufacturing, and respond promptly to foundry customer requests and events.

Requirements

Master or PhD with +1 year of experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field.
Minimum GPA of 3.5.
At least one publication in a peer-reviewed technical journal.
Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.

Nice To Haves

One or more years of experience in technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Delivering results for complex, time-critical technical projects.
Improvements and maintenance on equipment/instrumentation.
Previous related work experience in a semiconductor foundry.
Semiconductor fabrication processes and technology.

Responsibilities

Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1/IHS), and SMT/PCB technologies to support Intel’s future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.