Packaging Engineer

Microsoft • Redmond, WA

13d • $102,100 - $219,200

About The Position

Microsoft’s Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world’s most complex challenges. We are seeking a Packaging Engineer with a focus on mechanical simulation. This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment. At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. We are looking for a Packaging Engineer with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.

Requirements

• Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience
• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.
• Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
• Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).
• Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI

Nice To Haves

• Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience OR equivalent experience
• Experience with cryogenic or extreme-environment hardware (cryogenic, vacuum, low-vibration, or high-precision systems).
• Proficiency with FEA tools such as ANSYS, COMSOL, Abacus, or equivalent, including model setup, meshing strategies, and convergence assessment
• Familiarity with advanced packaging technologies (flip chip, substrates, interposers, solder joints, PCB attach).
• Experience correlating simulation with cryogenic test data and iterating models based on measurement feedback.
• Strong fundamentals in heat transfer, solid mechanics, and numerical methods.
• Demonstrated ability to translate ambiguous design questions into well-scoped simulation problems and actionable outputs.

Responsibilities

• Thermal, structural, and thermo-mechanical simulations for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.
• Develop simulations that span hand calculations, reduced-order models, and full finite-element analysis (FEA) depending on fidelity and program needs.
• Structural and thermo-mechanical simulations to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.
• Packaging reliability assessments, including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.
• Generate and maintain reusable simulation templates, material libraries, and modeling workflows to improve consistency and efficiency across the packaging team.
• Work in teams or independently as required.
• Embody our Culture and Values

Benefits

• Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level