Packaging Engineer

Apple

7d

About The Position

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible for providing Custom Silicon packaging solutions in a module/system for various consumer markets. In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. Must be a good negotiator and influencer to drive industry to meet company needs. We are looking for individuals who are very innovative with a proven track record to reduce package development cycle and qualify devices into a high-volume manufacturing environment.

Requirements

• BS degree
• 10+ years of relevant industry experience

Nice To Haves

• M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines
• Minimum of 10 years of experience in IC packaging
• AutoCAD knowledge
• APD knowledge
• Multi-physics simulation knowledge
• Industry experience and work on WLP either in IDM or Fabless companies
• Knowledge and hands-on experience on Wafer Bumping and Dielectric materials and their pros/cons
• Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel
• In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs)
• Good knowledge on Package Qualification and Reliability testing
• Expert level knowledge of common reliability failure modes
• Able to understand device physics and component/board level reliability testing
• Proven track record to bring a product/package from conceptual stage to development and to HVM environment
• Ability to construct Designs of Experiments and down-select materials and processes
• Good written and verbal communication skills
• Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings
• Able to perform independent research and development work with minimal supervision

Responsibilities

• Interface between internal product/device design, quality, supply chain, and external suppliers to develop and deploy new packaging technologies.
• Drive industry to meet company needs through negotiation and influence.
• Reduce package development cycle and qualify devices into a high-volume manufacturing environment.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior