Overlay Metrology Specialist – eBeam

KLAMilpitas, CA
Onsite

About The Position

KLA is seeking an experienced Product Applications Development Engineer to develop and deliver innovative eBeam overlay metrology applications for advanced logic, memory, and packaging technologies. Based in Milpitas, CA, this role will be responsible for developing, optimizing, and qualifying eBeam metrology applications for overlay, CD, EPE, and process control. The engineer will design and execute characterization plans to evaluate tool performance, accuracy, precision, matching, and throughput. This role also involves leading customer demonstrations, evaluations, head-to-head studies, beta testing, and production qualifications. Analyzing semiconductor process and metrology data to identify process issues, develop solutions, and drive process-control improvements is key. The position requires developing measurement recipes, Best Known Methods, technical documentation, and application reports. Troubleshooting customer issues and providing technical support for advanced semiconductor manufacturing applications are also essential. Collaboration with Product Engineering, Systems, Software, Algorithms, Marketing, and Sales teams is expected to drive product improvements and new application development. Additionally, the role involves providing technical training and application expertise to customers, field engineers, and internal teams, and supporting technology development for advanced logic, DRAM, NAND, and advanced packaging semiconductor processes.

Requirements

  • Expertise in overlay metrology, including eBeam, optical metrology, or both.
  • Thorough, in-depth understanding of customer technologies, requirements, and critical capability gaps.
  • Knowledge of optical CD, scatterometry, film metrology, and process characterization.
  • Ability to work effectively both independently and in cross-functional teams.
  • Minimum of 2 years of proven experience operating SEM and optical metrology systems in the semiconductor industry.
  • Demonstrated ability to lead projects from kickoff through completion, including clear planning and periodic and final reporting.
  • Ability to perform complex data and image analysis using data-analysis tools.
  • Excellent communication, organizational, analytical, and interpersonal skills, with the ability to present results frequently to internal and external customers.
  • Ability to travel domestically and internationally up to 50% on short notice; trips may last 4–8 weeks to support customer-site projects.

Nice To Haves

  • Experience with Python, MATLAB, JMP, SQL, or similar analytical tools is preferred.

Responsibilities

  • Develop, optimize, and qualify eBeam metrology applications for overlay, CD, EPE, and process control.
  • Design and execute characterization plans to evaluate tool performance, accuracy, precision, matching, and throughput.
  • Lead customer demonstrations, evaluations, head-to-head studies, beta testing, and production qualifications.
  • Analyze semiconductor process and metrology data to identify process issues, develop solutions, and drive process-control improvements.
  • Develop measurement recipes, Best Known Methods, technical documentation, and application reports.
  • Troubleshoot customer issues and provide technical support for advanced semiconductor manufacturing applications.
  • Collaborate with Product Engineering, Systems, Software, Algorithms, Marketing, and Sales teams to drive product improvements and new application development.
  • Provide technical training and application expertise to customers, field engineers, and internal teams.
  • Support technology development for advanced logic, DRAM, NAND, and advanced packaging semiconductor processes.

Benefits

  • medical
  • dental
  • vision
  • life
  • 401(K) including company matching
  • employee stock purchase program (ESPP)
  • student debt assistance
  • tuition reimbursement program
  • development and career growth opportunities and programs
  • financial planning benefits
  • wellness benefits including an employee assistance program (EAP)
  • paid time off
  • paid company holidays
  • family care and bonding leave
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