OPC Technology Transfer Engineer (R&D)

Texas Instruments • Dallas, TX

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About The Position

As a Senior OPC Technology Transfer Engineer within the Advanced Technology Development (ATD) organization, you will bridge initial R&D development and high-volume manufacturing (HVM) by owning the full lifecycle of transferring developed OPC technologies to production fabs. You will analyze process, equipment, layout, and tool differences between R&D and HVM environments to anticipate, mitigate, and resolve transfer risks before recipe release, supporting a seamless, high-yield production ramp-up. The role applies technical knowledge of semiconductor photolithography and etching to align transferred OPC solutions with production-line physics and hardware characteristics.

You will work across organizational boundaries with manufacturing operators, shift technicians, and fab staff to coordinate test-wafer execution and align expectations. You will use data-science methods to collect, analyze, and interpret large wafer-measurement datasets to evaluate OPC recipe performance for manufacturing sign-off. You will also analyze SEM images and critical-dimension (CD) data to verify R&D software-model behavior against production silicon. In addition, you will review automated OPC verification results to identify lithographic critical care-abouts and select metrology targets for layout review and CD-SEM tracking.

Requirements

• Master’s degree in Electrical Engineering, Physics, Computer Science, Chemistry, or a related field.
• At least 5 years of experience in semiconductor photolithography and/or OPC development.
• Lithography and RET expertise for 45 nm, 28 nm, 22 nm, or 20 nm processing nodes.
• Hands-on experience handling high-volume SEM measurement data and image inspections.
• Strong layout-review skills using OPC verification tools to determine and isolate critical metrology targets.
• Profound understanding of OPC development flows, process-window optimization, and design-rule constraints.

Nice To Haves

• Strong knowledge of advanced lithography processes, lithography simulation techniques, mask making, and RET techniques used in semiconductor manufacturing and process development.
• Demonstrated leadership and ability to influence cross-functional teams and communicate technical requirements effectively to manufacturing staff on the fab floor.
• Familiarity with physical layouts (GDS/OAS).
• Knowledge of lithography/OPC test-pattern design and layout execution using test-pattern generators, and experience with layout software such as Virtuoso or KLayout.
• Programming experience in a Unix environment.
• Understanding of OPC pattern-validation methodologies and process-window assessment techniques such as KLA’s Photolithography Wafer Qualification (PWQ).
• Strong analytical and problem-solving skills.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Strong time-management skills that enable on-time project delivery.
• Demonstrated ability to build strong, influential relationships.
• Ability to work effectively in a fast-paced and rapidly changing environment.
• Ability to take initiative and drive for results.

Responsibilities

• Own the lifecycle of transferring developed OPC technologies from R&D to production fabs.
• Analyze process, equipment, layout, and tool differences between R&D and HVM environments to identify and address transfer risks before recipe release.
• Align transferred OPC solutions with production-line physics and hardware characteristics, drawing on photolithography and etching knowledge.
• Partner with manufacturing operators, shift technicians, and fab staff to coordinate test-wafer execution and align expectations.
• Collect, analyze, and interpret large-scale wafer-measurement datasets to evaluate OPC recipe performance for manufacturing sign-off.
• Compile and analyze high-volume SEM images and critical-dimension (CD) data to verify R&D software-model behavior against production silicon.
• Analyze automated OPC verification results to identify lithographic critical care-abouts and select metrology targets for systematic layout review and CD-SEM measurement tracking.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior