MTS - Thermal Simulation Engineer

Micron•Richardson, TX

About The Position

Micron Technology’s Heterogeneous Integration Group (HIG), within the Technology and Products Group (TPG), develops High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. The MTS - Thermal Simulation Engineer provides technical leadership in advanced thermal and thermo-mechanical modeling for next-generation HBM products. The role defines simulation strategy, addresses complex thermal challenges across 2.5D/3D semiconductor packaging systems, advances physics-based model development and silicon correlation, and informs product, package, material, and process decisions across teams. The engineer leads multiphysics modeling, simulation validation, and development of scalable simulation methods for HBM and advanced packaging. The role also translates results into product and design guidance, collaborates with characterization, test, design, packaging, and process teams, and mentors engineers. It includes evaluating and responsibly applying AI-enabled solutions in engineering workflows to improve productivity, innovation, quality, and speed of execution.

Requirements

PhD plus 5 years of industry experience, or a master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field.
Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies.
Strong foundation in heat transfer, thermodynamics, and solid mechanics.
Hands-on experience with multiphysics simulation tools such as Ansys, Abaqus, Fluent, Star-CCM+, or FloTHERM.
Demonstrated expertise modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects.
Advanced experience with finite element modeling (FEM), coupled thermal-structural simulations, model calibration, and technical problem solving for complex systems.

Nice To Haves

Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers.
Familiarity with material characterization and effective thermal-property extraction across layered or heterogeneous systems.
Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques.
Exposure to CFD or flow-based simulation for cooling or package-level heat transfer.
Scripting or data-analysis skills in Python, MATLAB, or JMP to automate simulations and analyze results.

Responsibilities

Lead development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
Define and implement multiphysics simulation strategies involving thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions.
Analyze thermal transport, heat-flux distribution, and thermo-mechanical behavior across complex stacked memory architectures.
Lead simulation-to-silicon correlation with characterization and test teams, establish model-validation criteria, and close gaps between predictions and measured behavior.
Assess material properties, layout effects, package architecture, and manufacturing variation to identify drivers of thermal resistance and hotspot behavior.
Influence design, packaging, process, and test teams by translating simulation results into thermally aware product requirements and design direction.
Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies.
Mentor engineers and establish modeling guidelines.
Lead evaluation, adoption, and responsible use of AI-enabled solutions in engineering workflows, translating emerging AI capabilities into practical business value.