MTS - HBM Thermal Integration Engineer

Micron Technology • Richardson, TX

1d

About The Position

Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory (HBM) products. The role is part of the Heterogeneous Integration Group within the Technology and Products Group and works across thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration. The engineer will use thermal learning plans, characterization, design of experiments, and data-driven investigations to understand and improve product thermal behavior and performance.

Requirements

• PhD with 5 or more years of industry experience, or a master’s degree with 10 or more years of industry experience, in Mechanical Engineering, Materials Science, Physics, Semiconductor Engineering, Electrical Engineering, or a related technical field.
• Hands-on experience in semiconductor product development within memory, logic, or advanced packaging technologies, with a background in one or more of Process Integration, Package Integration, Product Engineering, or Yield Engineering.
• Working knowledge of thermal simulation methodologies and multiphysics modeling approaches, and ability to interpret simulation results and apply insights to silicon, package, and technology optimization.
• Experience designing, executing, and analyzing structured experiments and DOE-based investigations.
• Demonstrated ability to analyze large datasets, inline metrology data, characterization results, manufacturing data, and test results to identify performance drivers and sources of variation.
• Ability to leverage AI-enabled tools and workflows to analyze data, automate routine tasks, improve decision-making, and enhance the efficiency and quality of assigned responsibilities.

Nice To Haves

• Understanding of HBM, advanced semiconductor packaging, 2.5D/3D integration, TSV technologies, hybrid bonding, interposers, and heterogeneous integration.
• Experience with thermal characterization and silicon validation techniques.
• Experience analyzing inline metrology, manufacturing, assembly, and test datasets using statistical methods.
• Knowledge of variation analysis, process optimization, and root-cause investigation methodologies.
• Familiarity with thermal simulation tools such as Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+, or equivalent.
• Experience with Python, JMP, MATLAB, SQL, or similar data analysis environments.
• Experience leading cross-functional technology development initiatives in the semiconductor industry.

Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation.
• Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance.
• Collaborate with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements.
• Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis and structured problem solving.

Benefits

• Choice of medical, dental, and vision plans.
• Programs that help protect income in the event of illness or injury.
• Paid family leave.
• Paid time-off program.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior