MTS Design Architect-Custom Layout, HBM

Micron•Richardson, TX

About The Position

As an HBM Design Architect-Custom Layout Lead at Micron Technology, you will support the development of advanced analog, mixed-signal, and digital circuits, as well as full-chip integration for next-generation High Bandwidth Memory (HBM) products. The role focuses on physical design and layout, including optimized floorplans, circuit placement and routing strategies, and high-quality block-level layouts using advanced process nodes. You will collaborate with architecture, circuit build, and layout teams to support DRAM solutions focused on performance, power efficiency, and density. The role also supports the design and deployment of AI-enabled solutions to improve efficiency and decision-making. You will lead end-to-end layout execution for analog, mixed-signal, and custom digital blocks and overall chip integration. You will own full-chip technical decisions spanning analog, digital, memory, ESD, and EM/IR, with attention to performance, power, and area (PPA). The role involves developing layouts for memory and analog/mixed-signal blocks, collaborating on floorplanning and integration strategies, supporting new HBM architectures, and contributing design-focused insights to improve circuit robustness, performance, and reliability. You will participate in reviews and resolve issues involving physical build, parasitic extraction, and full-chip integration. Micron describes its benefits as supporting team members’ wellbeing, income protection, and future planning. Benefits include medical, dental, and vision plan options, paid family leave, paid time off, and paid holidays. The company also offers programs that provide income protection in the event of illness or injury.

Requirements

MS degree with 8+ years of memory-related custom layout design experience, or BS degree with 12+ years of relevant experience.
Expertise with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
Strong understanding of analog layout fundamentals, including matching, EM, latch-up, coupling, IR-drop, crosstalk, and parasitic impacts.
Hands-on experience developing analog and mixed-signal layouts, such as sense amplifiers, LDOs, and PLLs.
Strong analytical, problem-solving, and collaboration skills.
Experience leveraging AI to accelerate layout development.

Nice To Haves

Experience working on DRAM custom layout.
Ability to clearly communicate technical concepts to design, architecture, and verification teams.
Motivated contributor who excels in team-based, fast-paced engineering environments.

Responsibilities

Lead end-to-end layout execution of analog, mixed-signal, and custom digital blocks, as well as overall chip integration for HBM products.
Own full-chip technical decisions covering analog, digital, memory, ESD, and EM/IR, ensuring effective performance, power, and area (PPA).
Develop layouts for critical memory, analog, and mixed-signal blocks, including array layout, decoders, control logic, IOs, PLLs, ADCs, DACs, LDOs, bandgaps, reference generators, charge pumps, current mirrors, comparators, and differential amplifiers.
Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies.
Support integration of memory, logic, and analog circuits for new HBM product architectures.
Provide design-focused insights to improve circuit robustness, performance, and reliability.
Participate in reviews and fix issues across physical build, parasitic extraction, and full-chip integration.
Support the design and deployment of AI-enabled solutions that improve efficiency and decision-making.