Experienced MOL Module Integration Engineer

Samsung Electronics•Austin, TX

1d•$95,000 - $120,000•Onsite

About The Position

The Module Integration Engineering Middle Of Line (MIE MOL) team is focused on incoming technology transfer, production optimization, new product introductions, yield improvement, process margin improvement and performance enhancement. As part of the Advanced Node Process Integration team, you will provide Process Integration for products in a high volume production environment as well as optimization of newer products introduced exclusively at Samsung Austin Semiconductor Taylor Fab.

Requirements

Master’s, or PhD degree in Physics, Electrical Engineering, Materials Science or related field is required.
300mm 14nm/10nm/7nm/5nm nodes (or below) wafer manufacturing technology knowledge is highly preferred.
Experience in optimizing Contact or MOL module processes for manufacturability, uniformity and yield is highly preferred.
Experience in Yield or Process Integration in semiconductor manufacturing is strongly preferred.
Working knowledge of all unit processes including Thin Films Deposition (CVD, ALD, PVD Metals and Dielectrics), Lithography, Etch, Diffusion, Wet Process, Electroplating and CMP.
Demonstrated understanding of the interactions between process and yield, product performance and reliability.
Electrical Engineering, Materials Sciences, and Physics expertise within semiconductor field is required.
Experience with LSI manufacturing is strongly preferred.
Must have expert understanding of overall process flow in assigned areas.
Experience within 1 or more Unit Parts / Process Manufacturing groups is strongly preferred.

Responsibilities

Leads projects related to incoming technology transfer, productization, new product introductions, yield improvement, stop loss reduction, cycle time reductions and other KPI improvements.
Design, execute, and analyze experiments
Uses software to analyze data including statistical analysis; Consults with leadership team on experimental results in order to make decisions about large scale changes.
Lead / participate in Task Force Teams.
Responsible for critical or complex steps or layers in the wafer fabrication process.
Develops Change Point Management Plans.
Communicates technical information to senior leadership outside of the department through presentations.
Completes other duties as assigned.