Module Engineer On Shift (MEOS)

Intel•Chandler, AZ

20h•Onsite

About The Position

Intel's Epoxy MEOS team in Arizona is seeking a Packaging Module Development Engineer to develop and optimize assembly and packaging processes for next-generation semiconductor products. The role focuses on process quality, reliability, performance, cost, yield, productivity, and manufacturability in a semiconductor manufacturing environment. It includes process and equipment development, testing, reliability engineering, supplier coordination, and technical support for process improvements, while helping standardize product qualification and manufacturing practices.

Requirements

Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology, or a related field.
At least 2 years of hands-on experience in assembly and packaging technologies, technology, or manufacturing.
Ability to work on Shift 4: 6:00 PM–6:00 AM on an alternating weekly schedule, including Sunday–Tuesday nights and alternating Saturday nights.
Must be eligible to work without Intel immigration sponsorship.

Nice To Haves

At least 2 years of experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
At least 2 years of experience with laser, optical systems, or semiconductor assembly processes.
At least 2 years of experience in technology manufacturing or a semiconductor packaging environment.
At least 2 years of experience with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly settings.
Experience using data science and statistics tools such as Python, JMP, or Minitab for data analysis and visualization.
Curiosity and eagerness to learn, a collaborative spirit, analytical and creative problem-solving, attention to detail, effective communication, adaptability, and ownership and accountability.

Responsibilities

Design and develop assembly packaging processes and equipment for next-generation semiconductor technologies.
Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to develop and refine process and equipment specifications.
Conduct tests under simulated field conditions, including heat, humidity, and dynamic forces, to evaluate silicon and package technologies.
Oversee package design manufacturability and manage the lifecycle of packaging processes, procedures, and workflows.
Collaborate with suppliers and procurement teams to establish material specifications and ensure compliance with quality and performance standards.
Develop techniques, tools, and quality screens to identify packaging quality and reliability issues early in development.
Set reliability standards based on failure mechanisms and influence design, material selection, and process development.
Provide technical consultation and support for packaging process improvements and respond to internal customer and client needs.
Drive standardization in product qualification, manufacturing quality systems, and engineering practices in alignment with product milestones.