Intel Corporation is one of the world's leading semiconductor companies, dedicated to creating technology that changes the world. From powering the cloud to enabling AI, autonomous vehicles, and next-generation computing, Intel's innovations touch nearly every aspect of modern life. With a culture built on curiosity, collaboration, and a relentless drive to push boundaries, Intel offers engineers the opportunity to do the most meaningful work of their careers. Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a critical part of Intel's advanced manufacturing ecosystem, the SPTD team is driving the future of semiconductor packaging — and we're looking for talented engineers to help us get there. We are seeking a motivated and technically skilled Module Engineer On Shift (MEOS) to join our SPTD team at our state-of-the-art facility in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time support to ensure seamless lot movement through the production line. You'll work directly on the factory floor, solving complex equipment and process challenges, and collaborating with a talented team of engineers and technicians.
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Job Type
Full-time
Career Level
Entry Level