Module Engineer On-Shift (MEOS) – Day Shift (7)

Intel•Chandler, AZ

10d•Onsite

About The Position

Intel is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. Our Substrate Packaging Technology Development (SPTD) organization is at the forefront of advanced packaging solutions, with a mission to be the supplier of choice for leading-edge and affordable substrate packaging. At Intel, we believe in creating an inclusive, collaborative, and innovative workplace where every team member plays a vital role in changing the world through technology. We are looking for a motivated and detail-oriented Module Engineer On Shift (MEOS) to join our SPTD team in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time factory support to ensure seamless lot movement through the production line. You will work in a dynamic, fast-paced environment where your problem-solving skills and engineering expertise will directly impact the quality and efficiency of our substrate packaging manufacturing processes. Shift 7 Details: Shift Hours: 6:00 AM – 6:00 PM Schedule: Alternating 3- and 4-day work weeks (Thursday through Saturday and alternating Wednesday) This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience.

Requirements

Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 2+ years of relevant experience OR master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline
Relevant experience will be any of the following: Metrology Tools Exposure, Lithography tools, Laser Tools

Nice To Haves

2+ years of experience in: Statistical Process Control (SPC), Metrology tool recipe creation, and tool troubleshooting
Semiconductor Packaging or Packaging Substrate Manufacturing

Responsibilities

Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line.
Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift.
Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.
Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records.
Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data.
Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency.
Perform a variety of ad-hoc duties as required by the factory within your specific functional area.