Microelectronics Packaging Engineer (Level 3/4)

Northrop Grumman•Linthicum Heights, MD

85d•$108,800 - $203,600•Onsite

About The Position

Northrop Grumman Space Systems is seeking an experienced Electro-Mechanical Engineer (level 3/4) to join their team within the Intelligence Systems Business Unit. The successful candidate will independently lead mechanical design, analysis, integration, and testing for RF and EO aperture designs supporting multiple high-profile satellite programs. This role is ideal for a technically accomplished and strategic engineer who thrives in fast-paced, multidisciplinary environments and is eager to take leadership responsibility. This role will be worked out of Linthicum, MD. The ideal candidate will support development, design, fabrication, and test of various space sensor hardware work products across different program efforts. The qualified candidate will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. The candidate will support the design of space hardware and specifically support the mechanical development of micro-circuit technology. The micro-circuit technology will support equipment for antennas, electro-optical sensors, and supporting electronics chassis assemblies such as processors and receivers. The candidate will specifically be involved with micro-electronic devices that are used on tile sensor assemblies as well as circuit card assemblies. The role will also provide an opportunity to be involved with proposals of new space sensors designs and development of payload sensor components that comply with a multitude of customer mechanical requirements. This position is targeted for micro-circuit development; however, the candidate will have exposure to broader aspects of the overall sensor and system design. A candidate applying to the position would benefit from having prior experience supporting micro-electronic designs, designing for the consideration of space environments, and specifically space sensor elements such as tile assembly development. This position will report to the Electro-Mechanical Design manager of the Mechanical Systems Technology Department within Hardware Engineering. Minimal travel is expected.

Requirements

B.S degree in a STEM field with 5 years of engineering experience; or a Master’s degree in STEM and 3 years of engineering experience (for Level 3).
B.S degree in a STEM field with 8 years of engineering experience; Master’s degree in STEM and 6 years of engineering experience, or a Ph.D. and 3 years of experience (for Level 4).
Experience presenting complex technical programs and concepts to non-technical and technical personnel and customers.
Ability to successfully read and interpret schematics, block diagrams, sketches, oral and written instructions, manufacturer's specifications/operation manuals, and analyze hardware configurations
Ability to work independently and collaborate as part of a cross-functional team with other engineers, management, and contractors
Minimum 2 years of experience with mechanical design and analysis tools; AutoCAD and/or other 3D CAD software packages
No clearance required to start, but must have the ability to obtain and maintain a TS/SCI security clearance with Poly
United States Citizenship

Nice To Haves

Active TS/SCI clearance with Poly
Minimum 2 years of mechanical micro-circuit design experience
Experience with printed circuit board fabrication and testing
Experience with surface mount technology, including process steps to manufacture and test micro-circuits
Demonstrated technical design support of mechanical microcircuit design.
Ability to collaborate with multi-disciplinary teams.
Able to work in a fast-paced environment where multiple projects are being developed and deployed simultaneously

Responsibilities

Responsible for the mechanical development of advanced micro-circuit design as well as the assemblies that they support. (Ex. RF Tile Assemblies)
Responsible for the development of microcircuit advancements that are funded by internal NGC IRAD
Understanding of all aspects of hardware development. This will encompass all phases of design, including concept and detailed design development, CAD modeling efforts, documentation release, fabrication, integration, factory support and testing
Responsible for understanding technical performance of mechanical requirements of space program microcircuit hardware or subsystems (tile assemblies) of major satellite programs to assure cost, schedule and technical performance is achieved
Understand the integration and test process of space hardware and the special tooling that may be required
Present technical solutions and technical data at milestone reviews
Understand space environments and impact to space hardware
Research and develop procedures, methods, and tools for further the development of micro-circuit technology. This also includes space hardware conformance to documented and derived system requirements
Support program meetings in developing root cause and corrective actions
Troubleshoot or support technicians in troubleshooting issues with hardware designs during integration and test and provide suggestions for improvement and optimization
Facilitate knowledge sharing and mentoring
Verify space micro-circuit designs and performance by making necessary calculations
Lead or support department initiatives, recruiting, technology roadmap creation, cross-campus/sector involvement, and NCTA project leadership