Mechanical Engineer II - Microelectronics Packaging

RTX•San Diego, CA

5d•$75,800 - $144,200•Onsite

About The Position

Support development of novel advanced microelectronics packaging solutions within a team environment for a broad range of design challenges supporting advanced radar systems and subsystems throughout various IRAD, Development, and Production environment programs. Utilize a variety of standard hardware and materials to develop novel design and assembly approaches for advanced electronics. Perform mechanical analysis of packages and systems including first-order structural, thermal, and tolerance analyses. Support the full mechanical design lifecycle, including requirements development, concept generation, trade studies, material selection, free-body diagram development, and geometric dimensioning & tolerancing (GD&T) application. Create and support 3D models, engineering drawings, tolerance analyses, and manufacturing documentation required for hardware realization primarily using PTC Creo Parametric and Windchill Product Data Management System. Partner with manufacturing and test teams to support prototype builds, tooling development, integration activities, and verification testing. Participate in technical and design reviews while ensuring designs meet performance, quality, manufacturability, and reliability requirements. Support mechanical development efforts for microelectronics packages and higher-level assemblies while balancing technical performance, schedule, cost, and risk considerations. Work with a multi-disciplined team of engineers on mechanical housing design, electronics equipment packaging, circuit card assemblies, interconnects, and thermal management. Create and deliver presentations with clear and concise technical content. Position requires a minimum of 25% of travel to suppliers and production facilities, which includes domestic and international travel.

Requirements

Master's degree in Mechanical Engineering, Aerospace, Engineering Science, Physics, Math, or related (STEM) major obtained by start date.
Experience with the design, manufacturing, and integration of mechanical assemblies, electronics packaging, and/or test equipment for military and/or aerospace applications
Experience with Mil-Spec Hardware and Material Selections
Experience with PTC CREO Parametric or other Mechanical CAD Tools
Experience may be obtained through on-the-job experience, research, coursework, or projects
U.S. citizenship is required.
The ability to obtain and maintain a U.S. government issued security clearance is required.
Active and existing security clearance required after day 1.

Nice To Haves

Demonstrated Mechanical Engineering Design Knowledge
An Existing Secret or Top Secret Security Clearance
Experience with ANSI/ASME Y14.5 GD&T (Geometric Dimensioning and Tolerancing)
Printed Wiring Board (PWB) Design and Fabrication Knowledge
Circuit Card Assembly (CCA) Design and Layout Collaboration Experience
Knowledge of Electromechanical Assemblies and the Interrelationship of the Components Therein
Knowledge of Materials and Fabrication Methods
Knowledge of Mechanical Fabrication Techniques (Additive, Traditional Milling, EDM, etc…)
Experience With Suppliers of Machined Parts and Electronics
Ability to Interpret Standard Mechanical Fabrication and Assembly Drawings
Experience with Production Support Including Use of Basic Measurements Tools
Knowledge of Environmental Testing and Validation
Strong CAD, Technical Writing, and Oral Communication Skills
Experience with Creating and Delivering Technical Presentations

Responsibilities

Support development of novel advanced microelectronics packaging solutions within a team environment for a broad range of design challenges supporting advanced radar systems and subsystems throughout various IRAD, Development, and Production environment programs.
Utilize a variety of standard hardware and materials to develop novel design and assembly approaches for advanced electronics.
Perform mechanical analysis of packages and systems including first-order structural, thermal, and tolerance analyses.
Support the full mechanical design lifecycle, including requirements development, concept generation, trade studies, material selection, free-body diagram development, and geometric dimensioning & tolerancing (GD&T) application.
Create and support 3D models, engineering drawings, tolerance analyses, and manufacturing documentation required for hardware realization primarily using PTC Creo Parametric and Windchill Product Data Management System.
Partner with manufacturing and test teams to support prototype builds, tooling development, integration activities, and verification testing.
Participate in technical and design reviews while ensuring designs meet performance, quality, manufacturability, and reliability requirements.
Support mechanical development efforts for microelectronics packages and higher-level assemblies while balancing technical performance, schedule, cost, and risk considerations.
Work with a multi-disciplined team of engineers on mechanical housing design, electronics equipment packaging, circuit card assemblies, interconnects, and thermal management.
Create and deliver presentations with clear and concise technical content.
Travel to suppliers and production facilities, which includes domestic and international travel (minimum 25%).