Metrology OCD Library Team Section Manager #5665

TSMC•USA-Arizona, AZ

37d•Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Metrology OCD Library Team Section Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Requirements

Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 5 years of experience in an engineering role.
Alternatively, Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field and 7 years of progressive, post baccalaureate experience in an engineering role.
5 years of experience with semiconductor manufacturing principles, practices, and techniques as they relate to equipment engineering and maintenance.
5 years of experience with 5nm technology or below in logic chip semiconductor industry.
3 years of experience overseeing junior engineers.
3 years of experience in at least 1 of the following: 6-sigma process control; chemical quality improvement; and air/liquid purifier system.
5 years of experience in KLA Acushape/OLSA, Onto NanoDiffract/WVASE and Nova Mars software modeling, including library development.
Education or experience with designing DoE wafers and optimizing libraries for TEM or reference tool linearity.

Responsibilities

Develop and optimize OCD RCWA/ML library and film strategy model for inline/offline measurements during Fab ramping, mass production for NTO/Process CIP, including working with HQ/AZ metrology, Module teams, vendors, and relevant stakeholders.
Analyze OCD/Film spectrum in 3D/2D structure as well as inline result for problem-solving and process improvement, including working with full route process loop Integration owner, Module, vendors, and relevant stakeholders.
Support N5/N4/N3 production issue analysis to assist the Integration/Module/Metrology team in identifying root causes and providing technical insights for problem-solving.
Establish spectrum RMSE comparison system to monitor cross-fab inline process flow issue and matching.
Examine process tool chamber matching results based on spectrum errors to ensure proper tool chamber release.
Vendor coordination, including working with various metrology vendors for library and recipe setup, maintaining library workstation/server, upgrading systems, and troubleshooting.
Bolster engineers’ training in metrology measurement theory and library algorithm to enhance engineer knowledge.
Collaborate with various modules and integration to discuss and resolve metrology measurement issues.