Mechanical Engineer II (Onsite)
About The Position
Raytheon is seeking a Mechanical Engineer II to support new product development and enhancements within the Electronic Warfare Mechanical Design Hardware Section in Goleta, California. The section designs, integrates, verifies, and produces digital processor and RF receiver subsystems for airborne platforms. The engineer contributes to mechanical development and enhancements across multiple programs, collaborating with other department sections, engineering disciplines, and internal program customers. This is an onsite role; occasional travel to Raytheon facilities, suppliers, or customer sites may be required. The Mechanical Engineer II is a technical contributor working with more senior team members to design RF systems for demanding thermal and high-vibration environments. The work involves electronics packaging design and may include thermal and structural design and analysis; electrical component design, construction, and failure modes; printed wiring board and circuit card assembly processes and best practices; surface-mount and through-hole component installation processes and failure modes; metal fabrication and finishing methods; RF-isolation mechanical design; and environmental test methods and equipment.
Requirements
- Master’s degree in a Science, Technology, Engineering, or Mathematics (STEM) major by the start date.
- Experience with calculus, differential equations, calculus-based physics, statics, dynamics, mechanics of materials, thermodynamics, and heat transfer.
- Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.
- Experience may be obtained through on-the-job experience, research, coursework, or projects.
- U.S. citizenship is required because only U.S. citizens are eligible for the required security clearance.
- Ability to obtain and maintain a U.S. government-issued security clearance; an active and existing DoD Secret clearance is required after day one.
Nice To Haves
- Coursework and/or experience with mechanical engineering in a product development lifecycle, including design, packaging, manufacturing support, and/or hardware integration and testing.
- Experience creating and documenting mechanical designs in CREO or similar modeling tools.
- Experience with structural and thermal analysis using FEA modeling techniques.
- Experience with conformal antenna array packaging.
- Experience with electronics packaging, cabling and harness design, and printed wiring board designs and routing.
Responsibilities
- Contribute to mechanical development and enhancements for programs supported by the department.
- Work with more senior team members to design RF systems for challenging thermal and high-vibration environments.
- Perform electronics packaging design.
- Depending on assignment, support thermal and structural design and analysis; electrical component design and failure-mode work; printed wiring board and circuit card assembly processes; component installation processes; metal fabrication and finishing; RF-isolation mechanical design; and environmental test methods and equipment.
- Collaborate with other department sections, engineering disciplines, and internal program customers.
Benefits
- Medical insurance
- Dental insurance
- Vision insurance
- Life insurance
- Short-term disability
- Long-term disability
- 401(k) match
- Flexible spending accounts
- Flexible work schedules
- Employee assistance program
- Employee Scholar Program
- Parental leave
- Paid time off
- Holidays
- Potential annual short-term and/or long-term incentive compensation, depending on position level and collective-bargaining coverage
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
