Manufacturing Engineering Manager

Mercury Systems•Oxnard, CA

13d•Onsite

About The Position

Serves as the primary manufacturing process engineer for the New program at the Oxnard microelectronics facility. Owns the development, qualification, and production readiness of all GaN hybrid module assembly processes including eutectic die attach, wire/ribbon bonding, hermetic sealing, and substrate bonding. Performs PMP engineering functions per the program’s Parts, Materials and Processes Control Plan (PMPCP). Drives NPI process development from first principles through production qualification.

Requirements

Bachelor’s degree in Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related technical field.
Typically requires 7+ years of experience in microelectronics packaging, hybrid microcircuit assembly, semiconductor packaging, RF module manufacturing, or a closely related manufacturing environment.
Experience supporting hands-on manufacturing or production engineering activities.
Familiarity with high-reliability, aerospace, defense, military, or space-grade manufacturing standards.
Ability to work on-site in a production and engineering environment.
This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.
This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.

Nice To Haves

Experience with one or more of the following: eutectic die attach, epoxy die attach, substrate attach, wire bonding, ribbon bonding, hermetic sealing, laser welding, seam sealing, or parallel-gap welding.
Experience supporting microelectronics, RF, GaAs, GaN, power amplifier, or hybrid module manufacturing.
Experience with MIL-PRF-38534, MIL-STD-883, MIL-PRF-38535, NASA workmanship standards, J-STD-001, IPC-A-610, or similar standards.
Experience with process qualification, production readiness, FMEA, RCCA, DOE, or SPC.
Experience creating manufacturing work instructions, process specifications, travelers, routers, or qualification procedures.
Experience using inspection or failure-analysis methods such as X-ray, CSAM, SEM/EDS, cross-sectioning, DPA, or visual inspection.

Responsibilities

Develop, improve, and sustain manufacturing processes for microelectronic assemblies, including die attach, substrate attach, wire bonding, ribbon bonding, hermetic sealing, and coating processes.
Support new product introduction from engineering builds through production transition.
Troubleshoot process and yield issues using root cause analysis, data review, and corrective action methods.
Create and maintain work instructions, process flows, manufacturing routers, and qualification documentation.
Work with design engineering to translate product requirements into repeatable manufacturing processes.
Support first-article builds, engineering sample builds, and production readiness activities.
Partner with quality, test engineering, and operations to ensure products meet customer, military, and internal requirements.
Support material and process evaluations, including epoxies, solders, coatings, substrates, and related assembly materials.
Mentor technicians and engineers in manufacturing best practices.