This is a Summer 2027 internship in Chaska, Minnesota, running from May 17 through August 20, 2027. The intern will work as part of a small manufacturing engineering team to develop new processes, improve existing processes, and optimize manufacturing processes for semiconductor capital equipment. Each intern is assigned a project intended to deliver business value, and interns are expected to apply Lean principles and continuous-improvement thinking. Lean training and resources will be provided. The internship is payrolled through a payroll process provider.
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Career Level
Intern