This internship is for Summer 2027, running from Monday, May 17th to August 20th, 2027, located in Chaska, MN. Interns will engage in meaningful project work, applying Lean principles and continuous improvement thinking. The role involves being part of a manufacturing engineering team focused on developing new processes, improving existing ones, and optimizing the manufacturing process of semiconductor capital equipment. This internship is payrolled via a payroll process provider.
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Career Level
Intern