Manager - Mechanical Product Design Engineering (RF Space Electronics)

Boeing•El Segundo, CA
•$151,300 - $204,700•Onsite

About The Position

The Boeing Company’s Defense, Space and Security organization is seeking a Mechanical Product Design Engineering Manager for RF Space Electronics in El Segundo, California. The manager leads a team performing RF product design engineering and technical activities, supporting in-house work across the product lifecycle, from initial concepts and prototyping through production. The team’s work includes mechanical printed circuit board design, electronics packaging, and thermal, structural, and vibration analysis for satellite missions. The role develops and executes integrated departmental plans, policies, and procedures; contributes to departmental business and technical strategies, goals, and objectives; acquires resources; provides technical management of suppliers; and leads process improvements and corrective actions. The manager builds relationships with customers, stakeholders, peers, and partners, and develops direct reports. The position is expected to be 100% onsite in El Segundo, California. Candidates must complete an assessment as part of selection and satisfy the Company’s Conflict of Interest assessment process.

Requirements

  • Active U.S. Top Secret/SCI security clearance; U.S. citizenship is required. A clearance active within the past 24 months is considered active.
  • Bachelor of Science degree in Engineering focused on Electrical, Mechanical, or Aeronautical Engineering; Computer Science; Data Science; Mathematics; Physics; Chemistry; or a non-U.S. equivalent qualification directly related to the work statement.
  • At least one year of experience in a leadership role, such as team leader, temporary manager, large-scale cross-functional project/program management, or formal manager experience; alternatively, completion of Boeing’s internal “Exploring Leadership” course.
  • At least 5 years of experience in Electronics Packaging Design in Airborne, Space, Digital, RF, or Power mechanical systems.
  • At least 5 years of experience with Electrical, Electronic, and Electromechanical (EEE) component, Circuit Card Assembly, and Printed Wiring Board specification and quality requirements.
  • Must satisfy the Company’s Conflict of Interest assessment process.
  • Must meet U.S. export control compliance requirements as a U.S. Person.
  • Must complete an assessment as part of the selection process.
  • Employer will not sponsor applicants for employment visa status.

Nice To Haves

  • Previous experience designing digital or power units.
  • Master’s degree in Mechanical or Aerospace Engineering.
  • Experience in structural and thermal analysis.
  • Background in Earned Value Management System (EVMS).
  • Proficiency in CREO, Teamcenter, MS Project, and Expedition.
  • At least 5 years of experience leading engineering teams.

Responsibilities

  • Manage employees performing RF product design engineering and technical activities.
  • Develop and execute integrated departmental plans, policies, and procedures, and provide input on departmental business and technical strategies, goals, and objectives.
  • Acquire resources for department activities, provide technical management of suppliers, and lead process improvements and corrective actions.
  • Develop and maintain relationships and partnerships with customers, stakeholders, peers, partners, and direct reports.
  • Develop direct reports.
  • Support product work across the lifecycle, from initial design concepts through prototyping and final production, including mechanical printed circuit board design, electronics packaging, and thermal, structural, and vibration analysis.

Benefits

  • Competitive base pay and variable compensation opportunities.
  • Eligible employees may enroll in health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and programs providing paid and unpaid time away from work.
  • Relocation may be offered based on candidate eligibility; basic relocation is offered to eligible internal candidates.
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