ASML US develops and supports lithography machines that enable leading chipmakers to produce smaller, more powerful, and more energy-efficient microchips. In ASML EUV Light Sources, high-power lasers interact with tin material to create plasma that generates EUV light. Correct alignment between the lasers and tin is essential for efficient, stable operation, and high-speed camera images of EUV formation provide spatial information about this interaction. The intern will use machine learning and image-analysis techniques on high-speed images collected during controlled experiments. The objective is to identify image characteristics that indicate good laser-to-tin alignment and translate them into simple, measurable key performance indicators (KPIs). The intern will validate the proposed KPIs against performance measurements and assess their robustness across operating conditions. Success means identifying image-based KPIs that show clear, repeatable trends with alignment quality and improve observability compared with the methodology currently used on EUV sources. This position is on-site in San Diego, California. The role requires on-site presence for work-related events, trainings, and meetings, and may involve working in a clean room while wearing protective garments and equipment. Candidates must be authorized to work in the United States without employer sponsorship and legally authorized to access any controlled technology required for the position.
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Career Level
Intern