Lead Semiconductor Packaging Engineer - 843
About The Position
We are seeking an experienced Lead Semiconductor Packaging Engineer to work on a supplier site in Malta, NY as a full time Quantinuum employee developing innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers. All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test. Quantinuum is the world leader in quantum computing. The company’s quantum systems deliver the highest performance across all industry benchmarks. Quantinuum’s over 650 employees, including 400+ scientists and engineers, across the US, UK, Germany, and Japan, are driving the quantum computing revolution. By uniting best-in-class software with high-fidelity hardware, our integrated full-stack approach is accelerating the path to practical quantum computing and scaling its impact across multiple industries. By joining Quantinuum, you’ll be at the forefront of this transformative revolution, shaping the future of quantum computing, pushing the limits of technology, and making the impossible possible.
Requirements
- Minimum Bachelor’s degree with 10+ years’ experience OR Master’s degree with 8+ year’s experience OR PhD with 6+ year’s experience in advanced semiconductor packaging development
- Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
- Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.
Nice To Haves
- PhD in Physics or Engineering
- Experience with advanced large area multi-chip semiconductor packaging technologies
- Experience with large heterogeneous integration and 2.5-3D packaging techniques
- Experience with high-density I/O technologies
- Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling
- A proven track record of innovation and IP development
- Experience working within a cross-functional team environment
Responsibilities
- Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
- Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density
- Generate packaging requirements for mechanical, thermal, electrical, and optical performance
- Lead a team working with vendors to implement and validate packaging processes
- Support all stages of ion trap development to ensure compatibility with packaging
- Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
- Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities
Benefits
- Incentive Eligible – Range posted is inclusive of bonus target
- Flexible work schedule
- Employer subsidized health, dental, and vision insurance
- 401(k) match for student loan repayment benefit
- Equity
- 401k retirement savings plan
- 12 Paid holidays and generous vacation + sick time
- Paid parental leave
- Employee discounts
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What This Job Offers
Job Type
Full-time
Career Level
Senior
