Semiconductor Packaging Modeling and Simulation Engineer

onsemi • Scottsdale, AZ

19h

About The Position

ONSEMI is seeking a self-driven and motivated professional to join its Corporate R&D modeling and simulation team in Scottsdale, Arizona, or Waterloo, Ontario, Canada. The engineer will support new power module development and new product design, assembly and process, quality and reliability, and customers worldwide.

The role focuses on thermal-mechanical simulation of microelectronic packaging and systems, reliability analysis, model correlation with measured data, and development of modeling methods and tools. It also includes developing simulation approaches such as digital twins, AI and machine learning algorithms, crystal plasticity models, silver and copper sintering models, and probability and optimization algorithms for component- and system-level models.

onsemi describes itself as a supplier of semiconductor-based power and signal management, logic, standard and custom devices, with products serving automotive, communications, computing, consumer, industrial, medical, and military/aerospace applications. The company emphasizes energy-efficient and intelligent power and sensing technologies, with a focus on automotive and industrial markets.

Requirements

• Master’s or Ph.D. degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics, or Materials.
• Knowledge and experience in thermal-mechanical modeling, crystal plasticity, and copper/silver sintering processes.
• Knowledge and experience with CAD concepts and SolidWorks.
• Familiarity with semiconductor packaging.
• Familiarity with material thermal-mechanical properties.
• Strong knowledge of problem analysis and diagnosis techniques.
• Deep knowledge of nonlinear solid mechanics, fracture mechanics, and delamination.
• Familiarity with package testing and analysis, quality assurance, and reliability methods.
• Ability to correlate models with empirical measurements.
• Familiarity with Unix/Linux operating systems.
• Familiarity with ANSYS Mechanical APDL/Workbench FEA software.
• Strong English communication capability.
• Strong learning capability.
• Good team player.

Responsibilities

• Perform thermal-mechanical simulation for microelectronic packaging, systems, and assembly processes.
• Analyze existing packages for reliability issues induced by thermal problems.
• Analyze and correlate thermal-mechanical modeling results with measured data.
• Develop and maintain advanced thermal-mechanical modeling methodologies to improve efficiency and accuracy.
• Set up and maintain the hardware and software environment for thermal modeling.
• Support other thermal-mechanical modeling users within the company.
• Innovate new technology through simulation.
• Develop advanced simulation methodologies, including digital twins, AI and machine learning algorithms, crystal plasticity models, silver and copper sintering models, and probability and optimization algorithms for component- and system-level models.

What This Job Offers

• Job Type: Full-time