Micron Technology is seeking a Lead Principal Engineer to develop etch processes using state-of-the-art plasma etch tools, including Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), and Electron Cyclotron Resonance (ECR) technologies. The role collaborates with High Volume Manufacturing (HVM) fabs to deploy advanced dry etch technologies and accelerate production ramps, working with technology development partners, Operational Central teams, and HVM fabs. The position works with Technology Development and HVM to develop, deploy, and sustain end-to-end manufacturing excellence through supplier management and central operations execution. It establishes global alignment across organizations around cost, efficiency, new product introduction speed, and quality metrics, and influences HVM fabs on high-priority KPIs for yield enhancement, variability, and defectivity. The position supervises the work of other engineers and requires 10% international travel.
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Job Type
Full-time
Career Level
Principal