About The Position

Micron Technology is seeking a Lead Principal Engineer for etch process development at Micron Idaho Semiconductor Manufacturing (Triton) LLC. The role develops etch processes using state-of-the-art plasma etch tools and requires proficiency in Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), and Electron Cyclotron Resonance (ECR) technologies. The engineer collaborates with High Volume Manufacturing (HVM) fabs, technology development partners, and Operational Central teams to deploy advanced dry etch technologies and accelerate production ramps. The role works with Technology Development (TD) and HVM to develop, deploy, and sustain end-to-end manufacturing excellence through supplier management and central operations execution. It establishes global alignment around cost, efficiency, new product introduction speed, and quality metrics, and influences HVM fabs on high-priority KPIs for yield improvement, variability, and defectivity. The position supervises the work of other engineers and requires 10% international travel.

Requirements

  • Master’s degree in Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
  • At least 3 years of experience in the job offered or a related occupation.
  • Proficiency in Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), and Electron Cyclotron Resonance (ECR) technologies.
  • Experience with plasma dry etch technology.
  • Experience leading suppliers and establishing supplier accountability programs.
  • Experience establishing manufacturing team structures, standards, and processes.
  • Experience resolving yield-, defectivity-, and cycle-time-related issues in a process area.
  • Statistical analysis experience using JMP.
  • Experience driving dry etch area MOR-POR gaps, PMI, SPC, and CSPEC.

Responsibilities

  • Develop etch processes using state-of-the-art plasma etch tools.
  • Collaborate with HVM fabs to deploy advanced dry etch technologies and accelerate production ramps.
  • Engage with technology development partners, Operational Central teams, and HVM fabs.
  • Work with TD and HVM to develop, deploy, and sustain end-to-end manufacturing excellence through supplier management and central operations execution.
  • Establish global alignment across organizations focused on cost, efficiency, NPI speed, and quality metrics.
  • Influence HVM fabs on high-priority KPIs for yield enhancement, including variability and defectivity improvements.
  • Supervise the work of other engineers.
  • Provide technical guidance to resolve complex capacity or cost-reduction projects.

Benefits

  • Medical, dental, and vision plan options
  • Income-protection benefits for illness or injury
  • Paid family leave
  • Paid time off
  • Paid holidays
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