Micron Technology is seeking a Lead Principal Engineer for etch process development at Micron Idaho Semiconductor Manufacturing (Triton) LLC. The role develops etch processes using state-of-the-art plasma etch tools and requires proficiency in Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), and Electron Cyclotron Resonance (ECR) technologies. The engineer collaborates with High Volume Manufacturing (HVM) fabs, technology development partners, and Operational Central teams to deploy advanced dry etch technologies and accelerate production ramps. The role works with Technology Development (TD) and HVM to develop, deploy, and sustain end-to-end manufacturing excellence through supplier management and central operations execution. It establishes global alignment around cost, efficiency, new product introduction speed, and quality metrics, and influences HVM fabs on high-priority KPIs for yield improvement, variability, and defectivity. The position supervises the work of other engineers and requires 10% international travel.
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Job Type
Full-time
Career Level
Principal