Jr. Mechanical Design Engineer

Columbus Technologies and Services Inc•Pasadena, CA

4h•$40 - $60•Onsite

About The Position

This is a 2-year contract position with the potential for extension or conversion, offering full benefits and a 9/80 work schedule. The role requires customer and contract-specific training, which will be provided. The position is located at NASA Jet Propulsion Laboratory in Pasadena, CA, and is an onsite role. An offer is contingent upon successfully passing a background check and drug screen. Salary ranges are determined by role, level, and location, with the displayed range reflecting the minimum and maximum target for new hires across all US locations. Individual pay is influenced by work location, job-related skills, experience, and relevant education or training.

Requirements

Bachelor's degree in Mechanical Engineering or related technical discipline with a minimum of 3 years of related experience; Master's degree in similar disciplines with a minimum of 1 year of related experience; PhD with 0 years of related experience.
Working knowledge in Computer Aided Design (CAD) using tools such as Unigraphics NX and/or SolidWorks.
Broad knowledge and experience in one or more related fields in the following areas: design of printed wiring boards, design of mechanical chassis, manufacturing and assembly of printed wiring boards and cable harnesses.
Broad understanding and wide application of principles, theories, concepts and techniques in mechanical design.
Ability to solve packaging engineering mechanical design problems, perform trade studies, develop design requirements, create piece part and mechanical assembly designs, coordinate fabrication assembly, and qualification of hardware.
Knowledge of Standards for Geometric Dimensioning and Tolerancing (GD&T) per American Society of Mechanical Engineers (ASME) Y14.5.
Able to be flexible in handling work assignments.
Able to work in a team environment and meet deadlines.

Nice To Haves

Broad knowledge of applicable Laboratory policies and procedures, NASA policies and procedures, and government regulations.
Broad understanding and application of standard principles, theories, concepts and techniques in soldering operations, cable assembly and surface mount technology electronics manufacturing.
Some knowledge in electro-mechanical analyses such as thermal, structural and venting analyses for the subsystem.
Some knowledge of applicable industry and/or academic practices and standards in mechanical systems including structures, configuration, electronic packaging, structural/thermal analysis and integration and test.
Experience with spacecraft flight hardware development and testing.
Experience with Printed Wiring Board (PWB) design tools such as Mentor or Altium.
Experience with cable design, assembly, and testing.
Experience interfacing with suppliers or services including printed wiring board and mechanical fabrication, electronic assembly, project representatives, and mission assurance.
Working knowledge in Unigraphics NX and/or SolidWorks.

Responsibilities

Generate 3-D design models and drawings for spacecraft and instrument electronics subsystem and ground support equipment (GSE).
Define tasks and acquire resources to complete tasks on time and on budget.
Participate in a collaborative environment to design and develop support equipment for project and research applications.
Prepare for technical design and manufacturing status review presentations and close the reviews action items.
Lead and present design and analyses reviews.
Interface with engineers, designers, analysts, machine shop, Quality Assurance and project staff.
Plan and write work instructions to fabricate and assemble electronic packaging and cable harnesses.
Work independently and under the direction of the group supervisor, project management, technical leads, and proposal managers as required.