As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups.
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Career Level
Intern
Education Level
Ph.D. or professional degree