About The Position

The Texas Institute for Electronics (TIE) is a public-private partnership focused on advancing semiconductor manufacturing. We are developing cutting-edge equipment and processes for areas like advanced packaging, heterogeneous integration, and chip cooling. We are seeking motivated individuals to join our team and contribute to restoring U.S. leadership in semiconductor manufacturing. TIE is part of the Cockrell School of Engineering at The University of Texas at Austin, a globally recognized institution for technology innovation and engineering education. The Cockrell School is known for its strong academic programs, research centers, and its location in Austin, a city celebrated for its innovation and quality of life. UT Austin offers a dynamic work environment and a commitment to making a meaningful impact.

Requirements

  • Bachelor’s degree in semiconductor engineering fields such as Electrical Engineering, Chemical Engineering, Materials Science or other relevant disciplines.
  • Five years of relevant experience to include experience with Cu BEOL interconnects, including hands on experience with copper DD unit processes.
  • Working knowledge or experience with 3D ICs including various integration schemes.
  • Extensive familiarity with standard inline metrology and failure analysis techniques.
  • Experience with working on test vehicles to establish baseline processes.
  • Ability to work in a cleanroom for extended periods of time to inspect, oversee and debug processes. This includes the ability to gown to applicable clean room standards.
  • Experience with analysis and interpretation of BEOL parametric etest and reliability.
  • Strong data analytical skills (JMP, Python etc.) and communication skills.
  • Relevant education and experience may be substituted as appropriate.

Nice To Haves

  • Master’s degree or Doctoral degree in semiconductor engineering fields such as Electrical Engineering, Chemical Engineering, Materials Science or other relevant disciplines.
  • 10 or more years of experience in semiconductor process engineering.
  • 3 or more years of experience with unit processes in Copper CMP, particle free wet cleans or bonding.
  • Experience in a startup or research and development (R&D) environment
  • Experience with advanced technology nodes.
  • Experience in test vehicle design, layout, and/or extraction of parametric results.

Responsibilities

  • Drive unit process engineers and tool / material vendors towards achieving defined targets for integrated test vehicles.
  • Develop successful shortloop and full integrated processes to demonstrate various heterogeneous integration prototypes.
  • Significant hands-on role within the cleanroom is expected, initially with shared ownership of critical unit processes.
  • Define process window and resolve excursion through structured troubleshooting and investigation of failure modes.
  • Design and evaluate results of experiments on test vehicles for mechanical / electrical performance and reliability.
  • Able to work in a team environment, mentor junior engineers / students and communicate effectively.

Benefits

  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds
  • Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning plus professional conference opportunities
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
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