IC Package Design Engineer

Apple

18h

About The Position

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

Requirements

• BS and 10+ years of relevant industry experience

Nice To Haves

• Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms
• Knowledge of diverse package types (SiP, PoP, wirebond)
• Familiarity with verification tools (Calibre, CAM350)
• Strong understanding of high-speed interface layout constraints (DDR, PCIe)
• Experience with Signal/Power Integrity (SI/PI) analysis
• Experience with simulation tools like HFSS or PowerSI
• Experience with parasitic extraction (RLGC, S-parameters)
• Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM)
• Familiarity with various sophisticated package configurations and assembly technology
• Familiarity with a Unix/Linux environment
• Proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows

Responsibilities

• Lead advanced package architecture
• Drive next-generation package structure and configuration optimization
• Own Package/SiP/module physical design from concept through tape-out
• Collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies
• Leverage AI tools to enhance design efficiency, quality and performance

What This Job Offers

• Job Type: Full-time
• Career Level: Senior