IC Package Thermal Mechanical Engineer

Broadcom•Irvine, CA

22h•$109,700 - $175,500•Onsite

About The Position

This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products. As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize reliability, ensure high product yield, and resolve manufacturing challenges from early product definition through New Product Introduction (NPI). This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands-on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).

Requirements

Bachelor's degree with 8+ years of relevant industry experience; OR a Master's degree with 6+ years; OR a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.
Deep understanding of electronic packaging structures and advanced materials.
Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions).
Working knowledge of electromigration and general silicon/IC packaging reliability.
Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).
Strong capability in Ansys APDL, MATLAB, and Python.

Nice To Haves

Experience supporting electromigration assessments by developing accelerated testing for package-level interconnects (including BGA balls, C4 bumps, Cu pillars, microbumps, and metallization structures), and partnering with failure-analysis teams to identify root causes of degradation.
Hands-on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano-indentation).
Previous thermal engineering background utilizing tools such as Icepak and Flotherm.
Experience integrating Machine Learning and Gen-AI applications into engineering workflows is highly desired.

Responsibilities

Develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
Apply an in-depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip-package and package-board interaction challenges.
Streamline simulation workflows by developing reusable model-generation, post-processing, design-of-experiments (DOE), and reliability-data-analysis tools (Ansys APDL, Python, or MATLAB).
Leverage Machine Learning, Generative AI, and numerical tools to build automated user interfaces.
Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and utilize experimental data to define and predict overall product reliability.