About The Position

Boeing is seeking PhD students for its exclusive Graduate Researcher Program (GRP) in Engineering & Technology Innovation (E&TI) during the Summer of 2027. E&TI is Boeing's global research and development team focused on innovative technologies for aerospace. The GRP is a 10-12 week internship program designed for PhD students, offering a hybrid experience of real-world industry work and development programming. The program aims to deeply connect students with Boeing, potentially leading to a full-time offer upon completion of academic studies. GRP teams post requisitions aligned with Boeing’s strategic needs, matching them with top PhD talent. Interns gain meaningful, hands-on experience, applying academic expertise to industry challenges. The program includes mentorship, speaker talks, a summit, an innovation challenge, and networking opportunities. The work performed cannot contribute to the student's PhD thesis.

Requirements

  • Completed the first year of PhD studies by July 2027.
  • Ability to work full-time for 10-12 weeks during Summer 2027.
  • Pursuing a PhD in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline.
  • Coursework or research experience in one or more of the following: Digital logic design and verification, System-on-Chip architecture and integration, Semiconductor device physics, CMOS/BiCMOS fabrication and technology, Analog/mixed-signal circuit design, RF/millimeter-wave circuit design.
  • Strong analytical, problem-solving, and communication skills.
  • Ability to obtain U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.

Nice To Haves

  • Experience with industry-standard EDA tools (Cadence, Synopsys, Siemens EDA).
  • Experience with microelectronics in extreme environments, to include high radiation environments, extreme temperatures, and long life/high reliability.
  • Experience conducting independent research, publishing results, or presenting at conferences.

Responsibilities

  • Conducting research and development in advanced microelectronics, focusing on design, verification, modeling, test, or analysis of digital, analog, mixed-signal, or RF circuits, sub-systems, and SoCs for high-performance aerospace applications.
  • Applying expertise to emerging microelectronics challenges in AI, radar, EW, navigation, and secure communication systems.
  • Working collaboratively with senior Boeing engineers, researchers, and mentors to transition research concepts into viable technologies for Boeing programs.
  • Documenting findings, presenting results to technical leaders, and contributing to internal R&D knowledge bases.

Benefits

  • Health insurance
  • Flexible spending accounts
  • Health savings accounts
  • Retirement savings plans
  • Life and disability insurance programs
  • Paid and unpaid time away from work
  • Relocation assistance
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