Boeing Engineering & Technology Innovation Graduate Researcher Program, Microelectronics R&D Intern

Boeing•Tukwila, WA

4d•Onsite

About The Position

Join our exclusive Graduate Researcher Program (GRP) in Engineering & Technology Innovation (E&TI) during the Summer of 2027 and you can build something better for yourself, for our customers and for the world. E&TI is Boeing's global research and development team developing and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators. Join us and put your passion, determination, and skill to work building the future! The GRP (Graduate Researcher Program) is a unique 10-12 week internship program designed specifically for students pursuing their PhD. GRP is a hybrid experience of real-world industry work experience combined with development programming that exposes students to Boeing, its products, services and its people. GRP focuses on deeply connecting students to their team and Boeing through work experience across multiple summers with the goal of ultimately offering a full-time position at the conclusion of academic studies if a mutual fit is achieved. GRP host teams post intern requisitions aligned with Boeing’s strategic needs, aiming to match their needs with top PhD talent. Once candidates apply and are selected, they receive an offer to spend the following summer working with their host team. The program is designed to give interns meaningful, hands-on experience at Boeing, allowing them to apply their academic expertise while contributing to real-world industry challenges and opportunities. In addition to industry work exposure, students attend GRP programming to further broaden their experience and knowledge of Boeing. GRP programming components include: mentorship in your field of study, weekly Featured Speaker Talks, a week-long in-person GRP Summit, participation in an Innovation Challenge, and other opportunities to interact and build a professional network with other GRP students, Boeing team members, and Boeing leadership. Please note: The work you do at Boeing can be related to your area of study, but cannot contribute or be used in your PhD thesis.

Requirements

Completed the first year of PhD studies by July 2027
Ability to work full-time for 10-12 weeks during Summer 2027
Pursuing a PhD in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline
Coursework or research experience in one or more of the following: Digital logic design and verification, System-on-Chip architecture and integration, Semiconductor device physics, CMOS/BiCMOS fabrication and technology, Analog/mixed-signal circuit design, RF/millimeter-wave circuit design,
Strong analytical, problem‑solving, and communication skills
Ability to obtain U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.

Nice To Haves

Experience with industry-standard EDA tools (Cadence, Synopsys, Siemens EDA)
Experience with microelectronics in extreme environments, to include high radiation environments, extreme temperatures, and long life/high reliability
Experience conducting independent research, publishing results, or presenting at conferences

Responsibilities

Conducting research and development in advanced microelectronics, focusing on design, verification, modeling, test, or analysis of digital, analog, mixed-signal, or RF circuits, sub-systems, and SoCs for high‑performance aerospace applications
Applying expertise to emerging microelectronics challenges in AI, radar, EW, navigation, and secure communication systems
Working collaboratively with senior Boeing engineers, researchers, and mentors to transition research concepts into viable technologies for Boeing programs
Documenting findings, presenting results to technical leaders, and contributing to internal R&D knowledge bases