Ocotillo Failure Analysis Technician – TEM Prep

Intel Corporation•Chandler, AZ

12d•$44,230 - $85,340•Onsite

About The Position

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. As a Product Failure Analysis Technician, you will play a pivotal role in identifying and analyzing electrical, thermal, mechanical, package, or component failures within our products. In this role, you will perform TEM sample preparation and lab operations using state-of-the-art failure analysis tools. You will work closely with engineers to enable high-quality TEM analysis by preparing precise, site-specific samples and maintaining strong lab execution. This is an excellent opportunity for early-career candidates to gain hands-on experience in semiconductor failure analysis, advanced microscopy techniques, and high-volume lab operations. You will join a dynamic team within Intel's manufacturing and engineering organization, where the focus is on driving innovation, ensuring product reliability, and enhancing operational efficiency. This group plays an essential role in advancing Intel's mission to deliver cutting-edge technologies that power the modern world. By analyzing product performance and identifying solutions to improve overall quality, the team helps support Intel's commitment to delivering industry-leading products.

Requirements

High School diploma with 1+ years of hands-on experience in failure analysis, product testing, or a related domain OR an AA/AS degree with no prior professional experience
Demonstrated expertise in utilizing analysis tools such as electron microscopy, mechanical polishing, or similar techniques through coursework, academic projects, internships, or hands-on training
Proficiency in tracking and reporting systems for failure analysis cases
Basic mechanical aptitude and ability to follow detailed procedures
US citizenship required
Ability to obtain and maintain a US Government Security Clearance
Strong attention to detail and procedural discipline
Ability to work in a fast-paced, high-volume lab environment with changing priorities
Good communication skills and ability to work across shifts and teams
Demonstrated ability to work independently and collaboratively

Nice To Haves

Strong communication and collaboration skills demonstrated through team projects or professional settings
A passion for innovation, problem-solving, and contributing to process improvements
Ability to learn and adapt quickly to new methodologies and tools in the field of failure analysis
Associate's degree or technical certification in a related field
Exposure to: SEM, FIB, or materials characterization tools
Exposure to: Semiconductor processing or cleanroom environments
Experience working in a lab, manufacturing, or technical environment
Active US Government Security Clearance, with a minimum of Secret level

Responsibilities

Prepare TEM samples using Dual Beam FIB/PFIB and related techniques for site-specific analysis
Operate lab tools including SEM, FIB/PFIB, and optical imaging systems for material analysis and sample prep
Perform wafer handling, coating, and pre-treatment processes to support TEM workflows
Execute sample fabrication steps based on schematics, layouts, and engineering instructions
Partner with engineers and analysts to ensure samples meet quality and turnaround expectations
Support lab sustaining activities including safety, tool maintenance, and process documentation
Participate in process improvements, BKM development, and cross-training on new techniques
Maintain accurate documentation and follow standard operating procedures
Operate lab instruments to support high volume manufacturing of advanced technology nodes
Hands on handling Silicon Wafer/pieces
Operates lab tools, such as sputter coaters and spin coaters for sample pre-treatment
Operates Dual Beam FIB/PFIB to perform site-specific cross sectioning and prepare TEM samples, including site marking, depositing protective materials, de-layering, imaging and TEM lamella preparation
Operates SEM for imaging and material analysis
Works from schematics, diagrams, written and verbal descriptions, layouts or plans to perform moderately complex sample fabrication procedures
Participate in safety forums, lab sustaining and development, process transfer, tool ownership, BKM development, and cross training on other techniques
Willing to work compressed shift with 12hr shift
Ability to lift and carry up to 50 lb
Long time standing and walking occasionally