Ocotillo Failure Analysis Engineer – TEM/Probing Engineer

Intel•Chandler, AZ

10d•$103,730 - $170,630•Onsite

About The Position

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows. You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future.

Requirements

Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields.
2+ years of hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation in a lab or applications setting in other techniques OR 2+ years of experience in a lab setting where samples are prepared for analysis.
US citizenship required.
Ability to obtain and maintain a US Government Security Clearance.

Nice To Haves

MS, or PhD in Materials Science, Physics, Engineering or related STEM fields
Possibility of working a shifted schedule with at least one weekend day at least two weeks a month. (Sunday-Thursday or Tuesday-Saturday)
Knowledge of semiconductor process fundamentals and the advances in fabrication technology over the past decade.
Knowledge or direct experience with general failure analysis tools in a semiconductor laboratory.
Demonstrated independent quick-learning ability on lab instrumentation.
Excellent verbal and written communication skills.
Demonstrated ability to lead and manage lab staff.
Prior experience working with US Government contracts including security and sensitive document handling and/or Top-Secret US Government clearance.
Active US Government Security Clearance, with a minimum of Secret level.

Responsibilities

Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes.
Perform electrical probing and advanced characterization on silicon devices (wafer-level and site-specific structures)
Set up, operate, and troubleshoot probe stations and electrical measurement systems.
Execute complex test plans and interpret schematics, layouts, and device structures to support failure analysis workflows.
Analyze electrical data (e.g., IV, CV, leakage, shorts/opens) to support fault isolation and root cause identification.
Partner with FA engineers to integrate probing with SEM, FIB/PFIB, and TEM-based workflows.
Drive improvements in probing methods, workflows, and best-known methods (BKMs)
Provide technical guidance to junior engineers and technicians on probing techniques and lab practices.
Support tool ownership activities including troubleshooting, calibration, and uptime improvement.
Participate in lab sustaining, process transfer, and cross-functional yield improvement initiatives.