Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer
About The Position
As a Manufacturing Failure Analysis Engineer, you will be instrumental in identifying and resolving failures in silicon, components, and systems, driving improvements in yield, quality, and reliability. On a day-to-day basis, you will define failure analysis strategies, perform hands-on lab evaluations, and thoroughly investigate electrical and mechanical characteristics to pinpoint root causes. Your work will directly contribute to advancing Intel's next-generation technologies and ensuring the success of future products. Intel's Failure Analysis (FA) Lab in Chandler, Arizona is seeking a highly motivated AutoTEM/TEM Engineer to support high-volume manufacturing and yield improvement for advanced semiconductor technologies. In this role, you will perform automated and manual transmission electron microscopy (AutoTEM/TEM) analysis, enabling rapid defect characterization, process learning, and root cause identification. You will work closely with FA, yield, and process engineering teams to deliver high-quality data and accelerate debug cycles. This is an excellent opportunity for early-career engineers to develop expertise in advanced metrology, TEM workflows, and semiconductor failure analysis in a fast-paced production environment.
Requirements
- Bachelor's degree in Engineering or Physics related field.
- US citizenship required.
- Ability to obtain and maintain a US Government Security Clearance.
- Basic understanding in one of the following: Semiconductor manufacturing processes and device physics or Materials characterization or Microscopy theory/experience.
Nice To Haves
- Proficiency in failure analysis tools and techniques, including electrical testing, microscopy, and material characterization.
- Hands-on experience in failure analysis or quality assurance, with demonstrated skills gained through internships, academic projects, coursework, or hands-on training
- Master's degree in a relevant field with no prior professional experience.
- Exposure to microscopy, materials characterization, or lab-based work
- Academic or industry experience with: TEM, SEM, or FIB-based techniques, Semiconductor processing or failure analysis workflows
- Familiarity with data analysis and image interpretation
- Knowledge of advanced node device structures or process integration
- Experience working in a lab or high-volume manufacturing environment
- Active US Government Security Clearance, with a minimum of Secret level
- Strong attention to detail and data quality
- Ability to work in a fast-paced, high-throughput lab environment
- Effective communication and collaboration across cross-functional teams
- Demonstrated ownership and willingness to learn new tools and techniques
- Ability to balance multiple priorities and meet turnaround expectations
Responsibilities
- Operate AutoTEM and manual TEM workflows to support failure analysis and yield learning
- Prepare and analyze TEM samples, including coordination with FIB/PFIB and SEM processes
- Execute automated TEM job submissions and interpret results for engineering teams
- Analyze imaging data to identify defects, process issues, and device structural differences
- Partner with FA and yield teams to integrate TEM analysis into debug flows
- Support high-volume lab operations, including prioritization, throughput, and turnaround time
- Contribute to development and improvement of AutoTEM flows and best known methods (BKMs)
- Assist with tool ownership activities such as monitoring tool health, troubleshooting, and continuous improvement
- Maintain strong documentation of methods, results, and learnings
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
