Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer

Intel•Chandler, AZ

10d•Onsite

About The Position

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. The Role and Impact As a Manufacturing Failure Analysis Engineer, you will be instrumental in identifying and resolving failures in silicon, components, and systems, driving improvements in yield, quality, and reliability. On a day-to-day basis, you will define failure analysis strategies, perform hands-on lab evaluations, and thoroughly investigate electrical and mechanical characteristics to pinpoint root causes. Your work will directly contribute to advancing Intel's next-generation technologies and ensuring the success of future products. Intel's Failure Analysis (FA) Lab in Chandler, Arizona is seeking a highly motivated AutoTEM/TEM Engineer to support high-volume manufacturing and yield improvement for advanced semiconductor technologies. In this role, you will perform automated and manual transmission electron microscopy (AutoTEM/TEM) analysis, enabling rapid defect characterization, process learning, and root cause identification. You will work closely with FA, yield, and process engineering teams to deliver high-quality data and accelerate debug cycles. This is an excellent opportunity for early-career engineers to develop expertise in advanced metrology, TEM workflows, and semiconductor failure analysis in a fast-paced production environment. Business group Join Intel's manufacturing team, a vital part of our technology development and production organization. This group focuses on delivering world-class semiconductor solutions by driving innovation in manufacturing processes and product quality. Together, we enable cutting-edge advancements in computing and pave the way for Intel's global leadership in technology.

Requirements

Bachelor's degree in Engineering or Physics related field.
US citizenship required.
Ability to obtain and maintain a US Government Security Clearance.
Basic understanding in one of the following: Semiconductor manufacturing processes and device physics or Materials characterization or Microscopy theory/experience.

Nice To Haves

Proficiency in failure analysis tools and techniques, including electrical testing, microscopy, and material characterization.
Hands-on experience in failure analysis or quality assurance, with demonstrated skills gained through internships, academic projects, coursework, or hands-on training
Master's degree in a relevant field with no prior professional experience.
Exposure to microscopy, materials characterization, or lab-based work
Academic or industry experience with: TEM, SEM, or FIB-based techniques
Academic or industry experience with: Semiconductor processing or failure analysis workflows
Familiarity with data analysis and image interpretation
Knowledge of advanced node device structures or process integration
Experience working in a lab or high-volume manufacturing environment
Active US Government Security Clearance, with a minimum of Secret level

Responsibilities

Operate AutoTEM and manual TEM workflows to support failure analysis and yield learning
Prepare and analyze TEM samples, including coordination with FIB/PFIB and SEM processes
Execute automated TEM job submissions and interpret results for engineering teams
Analyze imaging data to identify defects, process issues, and device structural differences
Partner with FA and yield teams to integrate TEM analysis into debug flows
Support high-volume lab operations, including prioritization, throughput, and turnaround time
Contribute to development and improvement of AutoTEM flows and best known methods (BKMs)
Assist with tool ownership activities such as monitoring tool health, troubleshooting, and continuous improvement
Maintain strong documentation of methods, results, and learnings