3rd Shift Etch Process Support Engineer

RTX•Andover, MA

4d•$95,500 - $181,700•Onsite

About The Position

Raytheon is hiring an Etch Process Support Engineer for its RF Microelectronics/Module Design & Foundry Services Department in Andover, Massachusetts. The role supports etch-related processes for semiconductor products fabricated in the Andover foundry, including gallium arsenide, gallium nitride, and III-V focal plane array materials. It requires a basic understanding of microelectronics processing techniques such as wet etching, dry etching, and plating. The engineer provides engineering support and training to manufacturing personnel, reviews lots and wafers requiring special disposition, performs failure analysis of tools and processes, and supports tool and process qualification. The role also focuses on reducing rework and scrap and improving process-line efficiency. Frequent communication with manufacturing personnel, equipment teams, cell leads, and engineering leads—and a presence on the manufacturing floor—are important for resolving issues quickly and avoiding interruptions to customer commitments. The position involves processing wafers in a cleanroom to create FETs, MMICs, and FPAs. The engineer is expected to work autonomously with limited oversight, contribute to production-process maintenance and improvement, and communicate effectively across work centers and shifts. This is a 100% onsite, third-shift position in Andover, MA. U.S. citizenship and an active Secret DoD security clearance are required; the posting also states that the ability to obtain and maintain a U.S. government-issued clearance is required.

Requirements

Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM), typically required.
At least 5 years of relevant experience, or an advanced degree in a related field and at least 3 years of experience with semiconductor processing techniques such as wet etching, dry etching, and plating.
Ability to obtain and maintain a U.S. government-issued security clearance; U.S. citizenship is required.
Active and existing DoD Secret security clearance required after day one.
Ability to communicate effectively, multitask with attention to detail, maintain organized and documented processes, and work well in small cross-functional teams.

Nice To Haves

Advanced degree in Science, Technology, Engineering, or Mathematics (STEM).
Ability to document and present process-development status clearly and succinctly in meetings.
Knowledge of semiconductor processing and data analysis.
Experience with data-analysis software such as MATLAB, Python, SQL, or JMP.
Experience with quality standards and audits.
Ability to present and communicate effectively across different functions.

Responsibilities

Process wafers in a cleanroom to create FETs, MMICs, and FPAs.
Provide engineering support and training for manufacturing personnel.
Review and disposition lots and wafers requiring special evaluation or placed on hold.
Perform failure analysis of tools and processes.
Support work center leads with tool and process qualification efforts.
Identify opportunities to reduce rework and scrap and improve process-line efficiency.
Communicate with manufacturing personnel, equipment teams, cell and work center leads, operation leads, other shift engineers, and engineering leads.
Maintain or improve production processes as part of small, cross-functional teams.
Work autonomously with limited oversight and influence others regarding policies, practices, and procedures.
Maintain an on-floor presence to resolve issues quickly and help prevent interruptions to customer commitments.

Benefits

Medical insurance
Dental insurance
Vision insurance
Life insurance
Short-term disability
Long-term disability
401(k) match
Flexible spending accounts
Flexible work schedules
Employee assistance program
Employee Scholar Program
Parental leave
Paid time off
Holidays
Potential annual short-term and/or long-term incentive compensation, subject to eligibility and program conditions