ElectroMechanical Design Engineer Sr Stf: MicroElectronics
About The Position
You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware.
Requirements
- Experience with cable harness concepts for subsystem interfaces, generating wiring diagram
- Experience in circuit card assembly (CCA) / printed wiring board (PWB) design
- Familiarity with high-speed applications and PWB constraints
- Experience capturing flowed and derived requirements for electromechanical designs
- Must be a U.S. Citizen
- The selected candidate must be able to obtain a secret clearance.
Nice To Haves
- Familiarity with SOC / MCP solutions and ASIC verification and validation testing needs at the circuit card level
- Experience with parts and materials selections
- Ability to perform design trade studies; evaluating cost, weight, packaging, power benefits
- Familiarity with CAMEO
- Experience with flex circuit design
- Micro Electronics design experience.
Responsibilities
- Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
- Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
- Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
- Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
- Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
- Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
- Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
- Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
- Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.
Benefits
- Medical
- Dental
- Vision
- Life Insurance
- Short-Term Disability
- Long-Term Disability
- 401(k) match
- Flexible Spending Accounts
- EAP
- Education Assistance
- Parental Leave
- Paid time off
- Holidays
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
