ElectroMechanical Design Engineer Sr: MicroElectronics
About The Position
The ElectroMechanical Design Engineer will be part of the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. This team focuses on pioneering 2D/3D heterogeneous packaging concepts, integrating thin film, semiconductor, and high-performance thermal management technologies to create next-generation electronic systems for aerospace and defense missions. The role involves designing, prototyping, and testing cutting-edge packaging solutions in collaboration with electrical, systems, test, and product design engineers. The engineer will gain hands-on experience with emerging semiconductor manufacturing processes and translate them into flight-qualified hardware, working alongside Lockheed Martin’s senior Advanced Packaging SME.
Requirements
- DoD Secret level clearance or be able to obtain one.
- Working knowledge of CREO and Windchill
- Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis
- Packaging design experience
- Hardware design experience
- MUST BE A U.S. CITIZEN
Nice To Haves
- Experience with Zuken E3 and Mentor CCA design and development
- IDX File transfer
- Flex design
- Cable and harness design
- Micro Electronics experience.
Responsibilities
- Conceiving and modeling 2D/3D heterogeneous package architectures that meet size, weight, power and reliability targets.
- Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
- Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
- Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
- Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
- Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
- Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
- Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
- Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.
Benefits
- Medical
- Dental
- Vision
- Life Insurance
- Short-Term Disability
- Long-Term Disability
- 401(k) match
- Flexible Spending Accounts
- EAP
- Education Assistance
- Parental Leave
- Paid time off
- Holidays
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
