Electromagnetics (EM) and Packaging Design Engineer

Texas Instruments • Dallas, TX

2d

About The Position

Kilby Labs, Texas Instruments’ advanced R&D and product development support organization, is seeking a highly motivated and experienced electromagnetic modeling engineer. The role supports TI product development in areas including Silicon Photonics, RF filters, and 2.5D/3D heterogeneously integrated systems. It is responsible for RF modeling of new technology platforms and product ideas, working across advanced process technology development, packaging, chip design and test, and product engineering to develop innovative, high-performance, cost-effective solutions. The position focuses on RF design, electromagnetics, filter design, RFIC and module co-design, and advanced and heterogeneous packaging technologies. The ideal candidate is a creative problem-solver able to develop unique solutions.

Requirements

• Master’s or Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
• At least 3 years of industry experience in electromagnetic design.
• Understanding of S-parameters and impedance matching.
• Experience with semiconductor technologies such as CMOS, BiCMOS, GaAs, or InP, and a basic understanding of standard back-end-of-line (BEOL) stack-ups.
• Familiarity with one or more of Ansys HFSS, Keysight ADS, EMX, or Cadence Virtuoso.
• Basic experience with layout drawing.
• Basic experience with RF measurements.
• Ability to work independently and lead cross-functional collaboration between process, fab, and design teams.

Nice To Haves

• Understanding of RF and microwave circuits, electromagnetic theory, and analog and RF integrated circuit design.
• Knowledge of RF filter design.
• Knowledge of microelectronic fabrication and advanced packaging technologies.
• Knowledge of high-speed PCB design.
• Strong verbal and written communication skills.
• Ability to promote new ideas, build collaborative relationships, and work across organizations.

Responsibilities

• Drive and execute strategies for high-frequency and high-speed interconnect simulations for product development.
• Lead electromagnetic modeling for applications such as advanced packages, TSVs, and heterogeneously integrated 2.5D/3D systems.
• Build and analyze electromagnetic models of RF passive structures, including filters, matching networks, baluns, couplers, RF transitions, and interconnects.
• Perform electromagnetic simulations using tools such as HFSS and EMX.
• Run circuit- and system-level simulations using extracted S-parameters.
• Investigate RF interactions between circuits, package structures, and passive components.
• Draw mask layouts for test structures used in proof-of-concept studies and support technology development activities.
• Evaluate design trade-offs related to performance and manufacturability.
• Collaborate across process, fab, design, packaging, chip design and test, and product engineering teams.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level