Electromagnetics (EM) and Packaging Design Engineer

Texas Instruments • Dallas, TX

2d

About The Position

Kilby Labs, Texas Instruments’ advanced R&D and product development support organization, is seeking an experienced electromagnetic modeling engineer to support product development in areas including Silicon Photonics, RF filters, and 2.5D/3D heterogeneously integrated systems. The position is responsible for RF modeling of new technology platforms and product concepts and works extensively with advanced process technology development, packaging, chip design and test, and product engineering teams to develop innovative, high-performance, cost-effective solutions. The role suits a creative problem-solver interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced or heterogeneous packaging technologies.

The engineer will develop and execute high-frequency and high-speed interconnect simulation strategies; lead electromagnetic modeling for applications such as advanced packages, TSVs, and heterogeneous 2.5D/3D systems; and build and analyze models of RF passive structures. The work includes electromagnetic simulation, circuit and system-level simulation using extracted S-parameters, investigation of interactions among circuits, package structures, and passive components, mask-layout drawing for test structures and technology development, and evaluation of performance and manufacturability trade-offs.

Requirements

• Master’s or Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
• At least 3 years of industry experience in EM design.
• Understanding of S-parameters and impedance matching.
• Experience with semiconductor technologies such as CMOS, BiCMOS, GaAs, or InP, and a basic understanding of standard BEOL stack-ups.
• Familiarity with one or more of Ansys HFSS, Keysight ADS, EMX, or Cadence Virtuoso.
• Basic experience drawing layouts.
• Basic experience with RF measurements.
• Ability to work independently and lead cross-functional collaboration between process, fab, and design teams.

Nice To Haves

• Understanding of RF and microwave circuits, electromagnetic theory, and analog and RF integrated circuit design.
• Knowledge of RF filter design.
• Knowledge of microelectronic fabrication and advanced packaging technologies.
• Knowledge of high-speed PCB design.
• Strong verbal and written communication skills.
• Ability to promote new ideas, build collaborative relationships, and work across organizations.

Responsibilities

• Drive and execute strategies for high-frequency and high-speed interconnect simulations for product development.
• Lead electromagnetic modeling for applications including advanced packages, TSVs, and heterogeneously integrated 2.5D/3D systems.
• Build and analyze electromagnetic models of RF passive structures, including filters, matching networks, baluns, couplers, RF transitions, and interconnects.
• Perform electromagnetic simulations using tools such as HFSS and EMX.
• Run circuit- and system-level simulations using extracted S-parameters.
• Investigate RF interactions among circuits, package structures, and passive components.
• Draw mask layouts for test structures used in proof-of-concept studies and support technology development activities.
• Evaluate design trade-offs related to performance and manufacturability.
• Work independently and lead cross-functional collaboration among process, fab, and design teams.

Benefits

• Competitive pay and benefits designed to support employees and their families; country-specific benefits are available through the company benefits page.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level