Electromagnetic Engineer, Superconducting Qubit Package Modeling, Quantum AI

Google•Goleta, CA

3d•$174,000 - $252,000

About The Position

As an electromagnetic engineer focusing on quantum chip packaging, you will be responsible for electromagnetic modeling and validation of next-generation packages and interconnects to optimize their designs. You will use cryogenic microwave measurements and mechanical design inputs to construct high-fidelity 3D electromagnetic models for microwave packages, interconnects, and signal delivery lines. You will work at the intersection of mechanical and electromagnetic engineering to ensure high-speed signals maintain integrity through complex package transitions to the qubit chip. Google Quantum AI’s mission is to build a large-scale quantum computer capable of complex, error-corrected computations and unlock solutions to classically intractable problems. Its roadmap focuses on advancing quantum computing capabilities and enabling meaningful applications.

Requirements

PhD in Computer Science, a related field, or equivalent practical experience.
2 years of experience leading a research agenda.
One or more scientific publication submissions for conferences, journals, or public repositories.
2 years of coding experience (preferred qualifications).
1 year of experience leading research efforts and influencing other researchers (preferred qualifications).

Nice To Haves

2 years of coding experience.
1 year of experience leading research efforts and influencing other researchers.

Responsibilities

Develop high-fidelity 3D electromagnetic models of device packages, transitions, and microwave cavities using Ansys HFSS or CST Studio Suite.
Conduct high-frequency measurements using VNAs and TDRs to characterize physical prototypes in cryogenic setups.
Manage efforts to correlate empirical laboratory data with virtual 3D electromagnetic models and refine simulation models.
Interface with chip designers and packaging teams to provide actionable design guidelines.
Analyze package geometries to mitigate discontinuities, return loss, and crosstalk.